2022 International Conference on Biometrics,
Microelectronic Sensors and Artificial Intelligence (BMSAI 2022)
2022 International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence (BMSAI 2022) was held successfully on March 25, 2022 online. BMSAI 2022 was to bring together innovative academics and industrial experts in the field of Biometrics and Systems, Microelectronic biochemical Sensors and Artificial Intelligence. The primary goal of the conference was to promote research and developmental activities in related research, which was to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. There were 3 keynote speeches and 3 oral speeches being presented. Each one shared views and ideas of the latest reseach.
First of all, the host introduced the background of the conference and extended the warm welcome to all the participants on behalf of the committee. After the first keynote speaker, there was a "group photo" session and captured a screen for all the participants.
The first keynote speaker is Assoc. Prof. Wei Wei from Xi'an University of Technology, China. The speech title is: Based on IoTs Parking Navigation with Continuous Information Potential Field research.
After that, Prof. Yang Yue from Xi'an Jiaotong University, China. The speech title is: Multiparameter Optical Performance Monitoring of IMDD and Coherent Channels Using Deep Learning.
Assoc. Prof. P. C. Srinivasa Rao from Koneru Lakshmaiah University (KLU), India. The speech title is: Computational Intelligence for complex real-world problems.
Hao Liang, from Ocean University of China. The title of his speech is: A linearization scheme of thermistor temperature sensor.
Guishen Wang, from Ocean University of China. The title of his speech is: Design and calibration of bionic lateral line sensor based on PVDF.
Mingyang Li, from Xidian University, China. The title of his speech is: Research on Influence of Milling Process Parameters on Residual Stress of 7055 Aluminum Alloy.
This conference provided opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.